ABOUT THE INTERNATIONAL CONCRETE ABSTRACTS PORTAL

  • The International Concrete Abstracts Portal is an ACI led collaboration with leading technical organizations from within the international concrete industry and offers the most comprehensive collection of published concrete abstracts.

International Concrete Abstracts Portal

  


Title: Rheology of Fiber-Reinforced High-Strength Grout Modified with Polymer Latexes

Author(s): Joseph J. Assaad and Kamal H. Khayat

Publication: Materials Journal

Volume: 118

Issue: 6

Appears on pages(s): 49-60

Keywords: bond strength; fibers; high-strength grout; polymers; rheology; thixotropy

Date: 11/1/2021

Abstract:
Fiber-reinforced high-strength grout (HSG) can secure exceptional mechanical properties; yet, case studies show that the interfacing layer to the existing substrate can be particularly vulnerable when used in specialty repair, precast, and retrofitting applications. Polymeric latex materials such as styrene-butadiene rubber (SBR) and acrylic ester (AE) are often incorporated to improve the bond properties and ensure monolithic behavior of the composite system. This paper assesses the concurrent effects of using steel fibers (SFs) and polymeric latexes on the flow and rheology of HSG, including their impact on mechanical properties and bond to existing concrete. The SF content varied from 0 to 5% by volume, while the mixing water was replaced by 10 to 20% of latex. Test results showed that the rheological properties of HSG increased with latex inclusion, given the coalescence of watersoluble polymers in the cementitious matrix that increased the viscosity of the interstitial liquid phase. The viscosity was aggravated with the addition of SF that accentuates the tendency of fiber grouping and interference between solid particles to hinder the ease of flow. The compressive strength slightly decreased when part of the mixing water was replaced by SBR or AE. Yet, in contrast, the flexural properties and pulloff bond strength were remarkably improved, which can be relevant to guarantee the integrity and monolithic behavior of the repair application.


ALSO AVAILABLE IN:

Electronic Materials Journal



  

Please enter this 5 digit unlock code on the web page.