Simulation of residual stresses at holes in tempered glass: a parametric study

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Title: Simulation of residual stresses at holes in tempered glass: a parametric study

Author(s): J. Nielsen, H.Nielsen, J. Olesen, F. Olesen, P. Poulsen, N. Poulsen, H. Stang

Publication: RILEM

Volume: 43

Issue: 7

Appears on pages(s): 947-961

Keywords: Toughened glass, Finite element simulation, Bolted connections

Date: 7/1/2010

Abstract:
This work presents a full 3D numerical study of the residual stresses in tempered (toughened) glass near holes using Narayanaswamy’s model for the tempering process. It is the objective of the paper to elucidate the influence on the minimal residual compressive stresses at holes from variations in: the far-field stress, plate thickness, hole diameter and the interaction between holes and edges and corners. The work presents novel results for the sensitivity of the residual stresses to geometric features and provides a design tool for estimating residual stresses at holes for different geometries. An example of how to extrapolate the results in terms of far-field stresses is given.


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