Bond Strength between High-Performance Concrete and 7 mm Non-Pretensioned Plain Steel Wire

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Title: Bond Strength between High-Performance Concrete and 7 mm Non-Pretensioned Plain Steel Wire

Author(s): Andrzej Seruga and Marcin Dyba

Publication: Structural Journal

Volume: 122

Issue: 1

Appears on pages(s): 169-181

Keywords: bond behavior; bond stress-slip relationship; high-performance concrete (HPC); plain steel wire; pullout test.

DOI: 10.14359/51742145

Date: 1/1/2025

Abstract:
This paper examines the bond behavior between non-pretensioned plain steel wire and high-performance concrete (HPC). It investigates the effects of embedment length and concrete compressive strength on bond performance for the production of railway sleepers. To determine the performance, pullout concrete specimens reinforced with 7 mm diameter plain steel wire were cast and tested under a uniaxial load. The main test parameters include the embedment length: 40, 80, 120, 240, 330, and 460 mm; and concrete compressive strength: 40, 60, 72, and 88 MPa. The modified pullout test method developed at Cracow University of Technology was used in the experimental investigation. The study unequivocally demonstrates that the maximum bond stress between HPC and a non-pretensioned plain steel wire with a diameter of 7 mm decreases as the embedment length increases, irrespective of the concrete’s compressive strength. Furthermore, it was observed that the average bond stress increases with an increase in the concrete’s compressive strength with time. After conducting tests on HPC specimens with compressive strengths ranging from 60 to 88 MPa and embedment lengths ranging from 40 to 120 mm, it was determined that the resulting maximum adhesion bond stress was 2.22 MPa. This was 52% higher than the bond stress found in test pieces made of concrete with fcm = 40 MPa. Additionally, the average residual bond stress was found to be twice that of concrete with a compressive strength of 40 MPa. These findings demonstrate a clear advantage of using HPC in terms of bond stress.

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